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BSI
FEATURES
Very Low Power/Voltage CMOS SRAM 256K X 8 bit
DESCRIPTION
BS62LV2007
* Wide Vcc operation voltage : 2.4V ~ 5.5V * Very low power consumption : Vcc = 3.0V C-grade : 20mA (Max.) operating current I- grade : 25mA (Max.) operating current 0.1uA (Typ.) CMOS standby current Vcc = 5.0V C-grade : 35mA (Max.) operating current I- grade : 40mA (Max.) operating current 0.6uA (Typ.) CMOS standby current * High speed access time : -70 70ns(Max.) at Vcc = 3.0V -10 100ns(Max.) at Vcc = 3.0V * Automatic power down when chip is deselected * Three state outputs and TTL compatible * Fully static operation * Data retention supply voltage as low as 1.5V * Easy expansion with CE2, CE1, and OE options
The BS62LV2007 is a high performance , very low power CMOS Static Random Access Memory organized as 262,144 words by 8 bits and operates in a wide range of 2.4V to 5.5V supply voltage. Advanced CMOS technology and circuit techniques provide both high speed and low power features with a typical CMOS standby current of 0.1uA and maximum access time of 70ns in 3V operation. Easy memory expansion is provided by an active LOW chip enable (CE1), an active HIGH chip enable (CE2), and active LOW output enable (OE) and three-state output drivers. The BS62LV2007 has an automatic power down feature, reducing the power consumption significantly when chip is deselected. The BS62LV2007 is available in the JEDEC standard 36 ball Mini BGA 6x8 mm.
PRODUCT FAMILY
PRODUCT FAMILY OPERATING TEMPERATURE Vcc RANGE SPEED (ns)
Vcc= 3.0V
POWER DISSIPATION STANDBY Operating
(ICCSB1, Max) Vcc= Vcc= 5.0V 3.0V (ICC, Max) Vcc= Vcc= 5.0V 3.0V
PKG TYPE
BS62LV2007HC
0 O C to +70 O C 2.4V ~5.5V -40 O C to +85 O C
70/100
6 uA
0.7 uA
35 mA
20 mA BGA-360608
BS62LV2007HI
70/100
25 uA
1.5 uA
40 mA
25 mA
PIN CONFIGURATIONS
BLOCK DIAGRAM
A13 A17 A15 A16 A14 A12 A7 A6 A5 A4
Address Input Buffer
20
Row Decoder
1024
Memory Array 1024 x 2048
2048 DQ0 DQ1 DQ2 DQ3 DQ4 DQ5 DQ6 DQ7 8 Data Input Buffer 8 Column I/O Write Driver Sense Amp 256 Column Decoder 16 Control Address Input Buffer
8
Data Output Buffer
8
CE1 CE2 WE OE Vdd Gnd
A11 A9 A8 A3 A2 A1 A0 A10
Brilliance Semiconductor, Inc. reserves the right to modify document contents without notice.
R0201-BS62LV2007
1
Revision 2.1 Jan. 2004
BSI
PIN DESCRIPTIONS
BS62LV2007
Function
These 18 address inputs select one of the 262,144 x 8-bit words in the RAM CE1 is active LOW and CE2 is active HIGH. Both chip enables must be active when data read from or write to the device. If either chip enable is not active, the device is deselected and is in a standby power mode. The DQ pins will be in the high impedance state when the device is deselected. The write enable input is active LOW and controls read and write operations. With the chip selected, when WE is HIGH and OE is LOW, output data will be present on the DQ pins; when WE is LOW, the data present on the DQ pins will be written into the selected memory location. The output enable input is active LOW. If the output enable is active while the chip is selected and the write enable is inactive, data will be present on the DQ pins and they will be enabled. The DQ pins will be in the high impedance state when OE is inactive. These 8 bi-directional ports are used to read data from or write data into the RAM. Power Supply Ground
Name
A0-A17 Address Input CE1 Chip Enable 1 Input CE2 Chip Enable 2 Input
WE Write Enable Input
OE Output Enable Input
DQ0 - DQ7 Data Input/Output Ports Vcc Gnd
TRUTH TABLE
MODE WE CE1 CE2 OE I/O OPERATION Vcc CURRENT
Not selected (Power Down) Output Disabled Read Write
X X H H L
H X L L L
X L H H H
X X H L X
High Z High Z DOUT DIN
I CCSB, I CCSB1 I CC I CC I CC
ABSOLUTE MAXIMUM RATINGS(1)
SYMBOL V TERM T BIAS T STG PT I OUT PARAMETER
Terminal Voltage with Respect to GND Temperature Under Bias Storage Temperature Power Dissipation DC Output Current
OPERATING RANGE
UNITS
V
O
RATING
-0.5 to Vcc+0.5 -40 to +125 -60 to +150 1.0 20
RANGE
Commercial Industrial
AMBIENT TEMPERATURE
0 C to +70 C -40 C to +85 C
O O O O
Vcc
2.4V ~ 5.5V 2.4V ~ 5.5V
C C
O
W mA
CAPACITANCE (1) (TA = 25oC, f = 1.0 MHz)
SYMBOL
1. Stresses greater than those listed under ABSOLUTE MAXIMUM RATINGS may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect reliability.
CIN CDQ
PARAMETER Input Capacitance Input/Output Capacitance
CONDITIONS
MAX.
UNIT
VIN=0V VI/O=0V
6 8
pF pF
1. This parameter is guaranteed and not 100% tested.
R0201-BS62LV2007
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Revision 2.1 Jan. 2004
BSI
DC ELECTRICAL CHARACTERISTICS ( TA = 0oC to + 70oC )
PARAMETER NAME
VIL VIH IIL ILO VOL VOH ICC ICCSB ICCSB1
BS62LV2007
TEST CONDITIONS
Vcc=3.0V Vcc=5.0V Vcc=3.0V Vcc=5.0V
PARAMETER
Guaranteed Input Low Voltage(2) Guaranteed Input High Voltage(2) Input Leakage Current Output Leakage Current Output Low Voltage Output High Voltage Operating Power Supply Current Standby Current-TTL Standby Current-CMOS
MIN.
-0.5 2.0 2.2 --Vcc=3.0V Vcc=5.0V Vcc=3.0V Vcc=5.0V Vcc=3.0V Vcc=5.0V Vcc=3.0V Vcc=5.0V Vcc=3.0V Vcc=5.0V
TYP. (1) MAX.
----------0.1 0.6 0.8 Vcc+0.2 1 1 0.4 -20 35 1 2 0.7 6
UNITS V V uA uA V V mA mA uA
Vcc = Max, VIN = 0V to Vcc Vcc = Max, CE1= VIH, CE2= VIL, or OE = VIH, VI/O = 0V to Vcc Vcc = Max, IOL = 2mA Vcc = Min, IOH = -1mA CE1 = VIL, or CE2 = VIH, (3) IDQ = 0mA, F = Fmax CE1 = VIH, or CE2 = VIL, IDQ = 0mA
CE1Vcc-0.2V or CE20.2V, VINVcc-0.2V or VIN0.2V
-2.4 -------
1. Typical characteristics are at TA = 25oC. 2. These are absolute values with respect to device ground and all overshoots due to system or tester notice are included. 3. Fmax = 1/tRC .
DATA RETENTION CHARACTERISTICS ( TA = 0oC to + 70oC )
SYMBOL
VDR ICCDR tCDR tR
PARAMETER
Vcc for Data Retention Data Retention Current Chip Deselect to Data Retention Time Operation Recovery Time
TEST CONDITIONS
CE1 Vcc - 0.2V or CE2 0.2V, VIN Vcc - 0.2V or VIN 0.2V CE1 Vcc - 0.2V or CE2 0.2V, VIN Vcc - 0.2V or VIN 0.2V See Retention Waveform
MIN.
1.5 -0 TRC
(2)
TYP. (1)
-0.01 ---
MAX.
-0.5 ---
UNITS
V uA ns ns
1. Vcc = 1.5V, TA = + 25OC 2. tRC = Read Cycle Time
LOW VCC DATA RETENTION WAVEFORM (1) ( CE1 Controlled )
Data Retention Mode VDR 1.5V
Vcc
VIH
Vcc
Vcc
t CDR
CE1 Vcc - 0.2V
tR
VIH
CE1
LOW VCC DATA RETENTION WAVEFORM (2) ( CE2 Controlled )
Data Retention Mode
Vcc
Vcc
VDR 1.5V
Vcc
t CDR
tR
CE2 0.2V
CE2
R0201-BS62LV2007
VIL
VIL
3
Revision 2.1 Jan. 2004
BSI
AC TEST CONDITIONS
Input Pulse Levels Input Rise and Fall Times Input and Output Timing Reference Level Vcc/0V 1V/ns 0.5Vcc
WAVEFORM
BS62LV2007
KEY TO SWITCHING WAVEFORMS
INPUTS MUST BE STEADY MAY CHANGE FROM H TO L MAY CHANGE FROM L TO H DON T CARE: ANY CHANGE PERMITTED DOES NOT APPLY OUTPUTS MUST BE STEADY WILL BE CHANGE FROM H TO L WILL BE CHANGE FROM L TO H CHANGE : STATE UNKNOWN CENTER LINE IS HIGH IMPEDANCE "OFF "STATE
AC TEST LOADS AND WAVEFORMS
3.3V OUTPUT
100PF
INCLUDING JIG AND SCOPE
1269
3.3V OUTPUT
1269
,
5PF 1404
INCLUDING JIG AND SCOPE
1404
FIGURE 1A
THEVENIN EQUIVALENT 667
FIGURE 1B
OUTPUT
1.73V
ALL INPUT PULSES
Vcc GND
10%
90% 90%
10%
5ns
FIGURE 2
AC ELECTRICAL CHARACTERISTICS ( TA = 0oC to + 70oC, Vcc = 3.0V )
READ CYCLE
JEDEC PARAMETER NAME PARAMETER NAME DESCRIPTION
Read Cycle Time Address Access Time Chip Select Access Time Chip Select Access Time Output Enable to Output Valid Chip Select to Output Low Z Chip Select to Output Low Z Output Enable to Output in Low Z Chip Deselect to Output in High Z Chip Deselect to Output in High Z Output Disable to Output in High Z Data Hold from Address Change (CE1) (CE2) (CE1) (CE2) (CE1) (CE2) CYCLE TIME : 70ns MIN. TYP. MAX. CYCLE TIME : 100ns MIN. TYP. MAX.
UNIT ns ns ns ns ns ns ns ns ns ns ns ns
tAVAX tAVQV t E1LQV t E2HOV tGLQV t E1LQX t E2HOX tGLQX t E1HQZ tE2HQZ tGHQZ tAXOX
tRC tAA t ACS1 t ACS2 tOE t CLZ1 t CLZ2 tOLZ t CHZ1 t CHZ1 tOHZ tOH
70 ----10 10 10 ---10
-------------
-70 70 70 35 ---35 35 30 --
100 ----15 15 15 ---15
-------------
-100 100 100 50 ---40 40 35 --
R0201-BS62LV2007
4
Revision 2.1 Jan. 2004
BSI
SWITCHING WAVEFORMS (READ CYCLE)
READ CYCLE1
(1,2,4)
BS62LV2007
t RC
ADDRESS
t
D OUT
t
OH
AA
t OH
READ CYCLE2
CE1
(1,3,4)
t ACS1
CE2
t t CLZ
(5)
ACS2
t CHZ1, t
(5)
CHZ2
D OUT
(1,4)
READ CYCLE3
t RC
ADDRESS
t
OE
AA
t OE
CE1
t OH
t OLZ t CLZ1
(5)
t ACS1
t OHZ (5) (1,5) t CHZ1
CE2
t ACS2 t CLZ2
(5)
t CHZ2
(2,5)
D OUT
NOTES: 1. WE is high for read Cycle. 2. Device is continuously selected when CE1 = VIL and CE2= VIH. 3. Address valid prior to or coincident with CE1 transition low and/or CE2 transition high. 4. OE = VIL . 5. Transition is measured 500mV from steady state with CL = 5pF as shown in Figure 1B. The parameter is guaranteed but not 100% tested.
R0201-BS62LV2007
5
Revision 2.1 Jan. 2004
BSI
AC ELECTRICAL CHARACTERISTICS ( TA = 0oC to + 70oC, Vcc = 3.0V )
WRITE CYCLE
JEDEC PARAMETER NAME PARAMETER NAME DESCRIPTION
Write Cycle Time Chip Select to End of Write Address Set up Time Address Valid to End of Write Write Pulse Width Write Recovery Time Write Recovery Time Write to Output in High Z Data to Write Time Overlap Data Hold from Write Time Output Disable to Output in High Z End of Write to Output Active (CE1 , WE) (CE2) CYCLE TIME : 70ns MIN. TYP. MAX.
BS62LV2007
CYCLE TIME : 100ns MIN. TYP. MAX.
UNIT ns ns ns ns ns ns ns ns ns ns ns ns
tAVAX t E1LWH tAVWL tAVWH tWLWH tWHAX t E2LAX tWLOZ tDVWH tWHDX tGHOZ tWHQX
tWC tCW tAS tAW tWP tWR1 tWR2 tWHZ tDW tDH tOHZ tOW
70 70 0 70 35 0 0 -30 0 -5
-------------
-------30 --30 --
100 100 0 100 50 0 0 -40 0 -10
-------------
-------40 --40 --
SWITCHING WAVEFORMS (WRITE CYCLE)
WRITE CYCLE1 (1)
ADDRESS
t WC
t WR1
OE
(3)
t CW
CE1
(5)
(11)
CE2
(5)
t
WE
t CW
AW
(11)
t WR2
(2)
(3)
t AS
(4,10)
t
WP
t OHZ
D OUT
t DH t
DW
D IN R0201-BS62LV2007 Revision 2.1 Jan. 2004
6
BSI
WRITE CYCLE2 (1,6)
BS62LV2007
t WC
ADDRESS
t CW
(5)
(11)
CE1
CE2
(5)
t
WE
t CW
AW
(11)
t WR2
(2)
t WP
(3)
t AS
(4,10)
t WHZ
D OUT
t t DW
OW
(7)
(8)
t DH
D IN
(8,9)
NOTES: 1. WE must be high during address transitions. 2. The internal write time of the memory is defined by the overlap of CE1 and CE2 active and WE low. All signals must be active to initiate a write and any one signal can terminate a write by going inactive. The data input setup and hold timing should be referenced to the second transition edge of the signal that terminates the write. 3. TWR is measured from the earlier of CE1 or WE going high or CE2 going low at the end of write cycle. 4. During this period, DQ pins are in the output state so that the input signals of opposite phase to the outputs must not be applied. 5. If the CE1 low transition or the CE2 high transition occurs simultaneously with the WE low transitions or after the WE transition, output remain in a high impedance state. 6. OE is continuously low (OE = VIL ). 7. DOUT is the same phase of write data of this write cycle. 8. DOUT is the read data of next address. 9. If CE1 is low and CE2 is high during this period, DQ pins are in the output state. Then the data input signals of opposite phase to the outputs must not be applied to them. 10. Transition is measured 500mV from steady state with CL = 5pF as shown in Figure 1B. The parameter is guaranteed but not 100% tested. 11. TCW is measured from the later of CE1 going low or CE2 going high to the end of write.
R0201-BS62LV2007
7
Revision 2.1 Jan. 2004
BSI
ORDERING INFORMATION
BS62LV2007
Z YY
SPEED 70: 70ns 10: 100ns PKG MATERIAL -: Normal G: Green P: Pb free GRADE C: +0oC ~ +70oC I: -40oC ~ +85oC
BS62LV2007 X X
PACKAGE H: 36 Ball Mini BGA (6mm x 8mm)
Note: BSI (Brilliance Semiconductor Inc.) assumes no responsibility for the application or use of any product or circuit described herein. BSI does not authorize its products for use as critical components in any application in which the failure of the BSI product may be expected to result in significant injury or death, including life-support systems and critical medical instruments.
PACKAGE DIMENSIONS
A1 Ball Pad Corner A1 Ball Pad Corner 654321
1.375
SOLDER BALL A B C D E F G H
6.00.1 0.75 1.125 3.75
DETAIL A
DETAIL A
TOP VIEW
BOTTOM VIEW ( BALL SIDE )
1.4 MAX.
0.250.05
NOTE:
1. PIN#1 DOT MARKING IS BY LASER OR PAD PRINT.
SIDE VIEW
36 mini-BGA (6 x 8)
R0201-BS62LV2007
O0.350.05 (x36 balls)
8.00.1
5.25
0.75
8
Revision 2.1 Jan. 2004

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